Automatic Vacuum Plasma Cleaner Plasma Cleaning Equipment for Semiconductor Ceramics

• Customization: Available
• After-sales Service: Online
• Warranty: 1 Year
• Model NO.: LR-SPV-150
• Type: Plasma Cleaning Machine
• Accuracy Grade: 1
• Weight: 350kg
• Power Source: AC220V
• Transport Package: Wooden Package
• Specification: 1020×1720×1120mm (w×h×d)
• Trademark: Lonroy
• Origin: China
• HS Code: 9024800000
• Production Capacity: 200

Product Description

Product Description

Automatic Vacuum Plasma Cleaner Plasma Cleaning Equipment for Semiconductor Ceramics
1. Outline
Vacuum Plasma Cleaner(Plasma cleaner),the gas is separated into plasma state through the excitation power supply, and the plasma ACTS on the product surface to clean the pollutants on the product surface, so as to improve the surface activity and enhance the adhesion.Plasma cleaning is a new, environmental protection, efficient and stable surface treatment.

Automatic Vacuum Plasma Cleaner Plasma Cleaning Equipment for Semiconductor Ceramics
2. Product feature
1. Product placement fixture flexible, can adapt to irregular products
2. Horizontal electrode design can meet the requirements of soft product processing.
3. Low energy and gas consumption products.
4. Convenient way to put up and down the board
5. Vacuum system integration, small footprint
6. Reasonable plasma reaction space, so that the treatment is more uniform
7. Integrated control system design makes operation more convenient

Automatic Vacuum Plasma Cleaner Plasma Cleaning Equipment for Semiconductor Ceramics
3. Industry application
1. Mobile phone industry: TP, middle frame, back cover surface cleaning activation
2. PCB/FPC industry: hole drilling and surface cleaning, Coverlay surface coarsening and cleaning
3. Semiconductor industry: semiconductor packaging, camera module, LED packaging, BGA packaging, 4.Wire Bond pretreatment
5. Ceramics: packaging, pre-treatment of glue
6. Surface roughening etching: PI surface roughening, PPS etching, semiconductor silicon chip PN junction removal, ITO film etching
7. Plastic materials:  surface activation, ABS surface activation, and other plastic material cleaning activation
8. Clean the surface before applying ITO

Product Parameters

Automatic Vacuum Plasma Cleaner Plasma Cleaning Equipment for Semiconductor Ceramics
4. Specification of equipment

Power system		radio-frequency power supply	medium-frequency power supply
	power	0~600W	0~1000W or 0-2000W
	frequency	13.56MHz	40KHz
Vacuum plant	Double-stage vane pump (oil pump)	Double stage rotary vane pump (oil pump) or Roots pump + single stage rotary vane pump
	vacuum line	All stainless steel piping and high strength vacuum bellows
	texture	Aluminum alloy (customizable stainless steel cavity)
	thickness	25mm
	leakproofness	Militar grade welding seal
	Cavity internal dimensions	500×500×670mm (width × height × depth)
	Effective size of electrode plate	587×470mm(width × depth)
	Available space spacing	34mm
	Electrode layout	Horizontal arrangement, activity extraction
	Work tray	Standard one set, material optional (aluminum, steel wire mesh)
	work space	8 layer
Gas system	flow range	0~300SCCM
	Process gas path	Standard with two, can be customized
Control system	systems control	PLC
	delivery method	7 inch touch screen
Other parameters	boundary dimension	1020×1720×1120mm(w×h×d)
	weight	350KG
	Equipment appearance color	silver gray

5. Factory specifications

Factory specifications
Ac power specification	Power supply:AC380V,50/60Hz,5wire,50A
Factory exhaust	Flow:2.0 m³/min
Gas requirements for plant work	Flow:1~10 L/min Pressure:3~7 kg/cm² Pipe diameter:8×5mm Texture:PU pipe Purity:More than 99.99%
Factory compressed air requirements	Flow:1~10 L/min Pressure:3~7 kg/cm² Pipe diameter:8×5 mm Texture:PUpipe Dew point:-40ºC under Particle>0.3μm:10Pcs/ft³

6. General  Requirements

General requirements
Risk identification	High pressure hazard identification
Service environment	temperature:15~30ºC humidity:30~70%
Other matters needing attention	No combustible gases, corrosive gases, explosions or reactive dust Gas cylinders need to be fixed

Configuration list
Serial Number	Name	description		unit	quantity
1	Main engine	boundary dimension:1020×1720×1120mm (width × height × depth)		platform	1
2	Love sincerely	Aluminum alloy vacuum chamber inside dimension 500×500×675mm (width × height × depth)		individual	1
3	Excitation power supply	radio-frequency power supply	edium-frequency power supply	cover	1
		frequency:13.56MHz; Power 0 ~ 600 w Or 0~1000W is optional; Fully automatic vacuum capacitor matching unit	frequency:40KHz; 0~1000W or 0-2000w
4	PLC	Siemens,S7-200		individual	1
5	Touch screen	Wei lun tong,7 inch screen,MT6071iE		individual	1
6	Flowmeter	British wawick brand		individual	2
7	Vacuum pump	Flyover double-stage vane pump (oil pump):60m3/h		platform	1
8	Vacuum gauge	The fu kang		individual	1
9	Specification	Vacuum plasma cleaning machine spv-150 operation manual		part	1

Maintaining
Project	Examination content	Lifetime	frequency of inspection
Oil pump	Filter element	Hours of use 2000H	15 days
	Pump oil	Hours of use2000H	15 days

Equipment size drawing
1. Drawings of the size of the main engine2. Drawings of plasma cavity

Optional table:

Optional table
excitation power supply	radio-frequency power supply	medium-frequency power supply
	Shengding customized power supply: frequency13.56MHz; Power 0~600W or 0~1000W choosable; Fully automatic vacuum capacitor matching unit.	frequency40KHz,power 1000W
	America CERESPower supply: frequency13.56MHz; Power 0~600W or 0~1000Wchoosable ; American CERES automatic vacuum capacitor matcher
vacuum pump	Germany laibao double-stage vane pump (oil pump):60m3/h
	Flyover double-stage vane pump (oil pump):60m3/h

Detailed Photos